|
Direct bonding SiC | Compact SiC |
W(F.C)% | ≤1 | ≤1 |
W(Fe2O3 | ≤0.2 | ≤0.2 |
Pressure resisting(mpa) | ≥229 | ≥300 |
Bending strength(mpa) | ≥50 | ≥60 |
1400℃ bending strength(mpa) | ≥60 | ≥70 |
Bulk density(g/cm3) | ≥2.71 | ≥3.4 |
Apparent porosity(%) | ≤15 | ≤1.5 |
1000℃ thermal conductive | ≥27 | ≥45 |